A method of detecting open circuit defects within an integrated circuit.
The invention includes locating a conductive plate proximate to a top
surface of the integrated circuit. A voltage potential is coupled to the
conductive plate. The voltage potential of the conductive plate couples to
open circuit interconnections within the integrated circuit. Open circuit
interconnections are identified by monitoring the quiescent current
conducted by the integrated circuit while controlling the voltage on the
conductive plate and controlling inputs to the integrated circuit.