In a multi chip module of a structure wherein a plurality of bare or packaged
semiconductor chips are mounted on a single wiring board and upper surfaces of
the semiconductor chips are covered with a single heat spread plate, the whole
space around the semiconductor chips thus sandwiched between the wiring board and
the heat spread plate is filled with resin.
By so doing, the semiconductor chips are interconnected through the resin, so
that even if a stress is exerted on any of the chips, it is dispersed and therefore
it is possible to diminish the occurrence of cracks in the chips and the heat spread
plate caused by stress concentration. Besides, since the semiconductor chips and
the heat spread plate are bonded together with resin, even if there are variations
in size of the chips, both can be bonded easily. Further, the bonding of all the
chips and the heat spread plate can be done in a single process.