A thermal dissipation assembly and method, and a cooled multi-drawer electronics
rack are provided having a first cooling loop and a second cooling loop. The first
cooling loop is disposed substantially within an electronics drawer and positioned
to extract heat from an electronics module within the drawer. The first cooling
loop further includes a first planar heat transfer surface. The second cooling
loop is disposed substantially external to the electronics drawer and includes
a second planar heat transfer surface. A biasing mechanism mechanically forces
the first planar heat transfer surface and the second heat transfer surface coplanar
when the electronics drawer is in a docked position in the electronics rack to
facilitate the transfer of heat from the first cooling loop to the second cooling loop.