A heat duct-equipped heat-radiating device for power supply, including: a
heat conductive board tightly attached to a heat source of the power
supply; a heat duct tightly bridged over the heat conductive board, one
end of the heat duct outward protruding from the housing of the power
supply; and a fin body fixedly mounted on outer side of the housing of
the power supply. The fins of the fin body are respectively formed with
corresponding fitting holes through which the heat duct is fitted to
contact with the fins. Accordingly, the heat generated by the heat source
of the power supply is quickly conducted through the heat duct to the fin
body on outer side of the housing and dissipated from the fin body to
outer side.