A plurality of film formation layers where film formation patterns are
formed, respectively, interlayer films which are formed between the
plurality of film formation layers, respectively, a plurality of
sub-interlayer-film wiring patterns, which are formed in film formation
layers beneath the planarized interlayer films of the interlayer films, a
plurality of contact holes formed in the planarized interlayer films in
order to connect the plurality of sub-interlayer-film wiring patterns and
the film formation patterns of layers above the planarized interlayer
films, and one or more dummy patterns which are formed on a plurality of
positions under the plurality of contact holes and which are formed in
one or more film formation layers under the plurality of
sub-interlayer-film wiring patterns, respectively so as to control the
positions of the surfaces of the plurality of sub-interlayer-film wiring
patterns.