In a method of measurement according to one embodiment of the invention, a
relative position of a temporary alignment mark on one side of a
substrate and an alignment mark on the other side of the substrate is
determined, and the temporary alignment mark is removed. Before removal
of the temporary alignment mark, a relative position of that mark and
another mark on the same side of the substrate may be determined. The
temporary alignment mark may be formed in, e.g., an oxide layer.