A bumped semiconductor device contact structure is disclosed including at
least one non-planar contact pad having a plurality of projections
extending therefrom for contacting at least one solder ball of a bumped
integrated circuit (IC) device, such as a bumped die and a bumped
packaged IC device. The projections are arranged to make electrical
contact with the solder balls of a bumped IC device without substantially
deforming the solder ball. Accordingly, reflow of solder balls to reform
the solder balls is not necessary with the contact pad of the present
invention. Such a contact pad may be provided on various testing
equipment such as probes and the like and may be used for both temporary
and permanent connections. Also disclosed is an improved method of
forming the contact pads by etching and deposition.