A method and apparatus is provided for molding a semiconductor device in a
mold including two mold halves. One mold half includes a compressible
sealing mechanism constructed and configured to exert a sealing pressure
between a surface of the mold half and a surface of a semiconductor
device located in the mold. A compliant tape is positionable onto the
mold half comprising the sealing mechanism between the semiconductor
device and the sealing mechanism for molding of the semiconductor device.