The present invention provides the steps of (a) forming a first electrode
on a substrate via an adhesion enhancing layer, (b) forming a capacitor
insulating film containing a laminated film, in which an amorphous
dielectric film and a polycrystalline dielectric film are laminated via a
wave-like interface, by forming sequentially and successively the
amorphous dielectric film and the polycrystalline dielectric film made of
same material on the first electrode, (c) forming a second electrode on
the capacitor insulating film, and (d) a step of annealing the capacitor
insulating film in an oxygen atmosphere.