A chip package and fabricating method thereof are provided to maintain the
thermal dissipating efficiency and reduce the damage to the chip. The
edge of the exposed portion would be cracked caused by external force
because of the substrate of the chip is brittle. The crack in the edge of
the chip will degrade the reliability and induce the malfunction of the
chip. In this case, the chip is disposed at least one elastic element at
the edges of the exposed side to reduce the risk of the crack in the
chip.