A circuit component built-in module is provided in which a solder that is
remelted when the circuit component built-in module is mounted on a
motherboard by using the solder is prevented from flowing to the outside
of the prescribed electrodes.A first groove (116) is formed in a solder
resist (106) located between two electrodes (103) to which a circuit
component (104) is connected. A configuration is used in which the space
between the first groove (116) and circuit component (104) is filled with
a first insulating resin (107).