An electronic module and a method of assembling the electronic module. A
circuit board is connected to a chip substrate by an array of connectors,
and a base member is on the side of the circuit board away from the chip
substrate and connector array. An elastomeric structure is placed between
the circuit board and the base member. The elastomeric structure has
voids between a first defining plane adjacent the circuit board and a
second defining plane adjacent the base member, with the voids adapted to
permit local deformation of elastomeric material in the structure. The
method includes applying a compressive force between the circuit board
and base member to at least partially compressing the elastomeric
structure to improve load equalization on the circuit board.