The dicing die-bonding film of this invention comprises a
pressure-sensitive adhesive layer on a supporting base material and a
die-bonding adhesive layer on the pressure-sensitive adhesive layer,
wherein a releasability in an interface between the pressure-sensitive
adhesive layer and the die-bonding adhesive layer is different between an
interface corresponding to a work-attaching region in the die-bonding
adhesive layer and an interface corresponding to a part or the whole of
the other region, and the releasability of the interface is higher than
the releasability of the interface. According to this invention, there
can be provided a dicing die-bonding film excellent in balance between
retention in dicing a work and releasability in releasing its diced
chipped work together with the die-bonding adhesive layer.