A heat sink for an electronics enclosure is disclosed. The heat sink
comprises a thermal conduction section with an inner surface and an outer
surface, the thermal conduction section having an extended profile that
tapers from a first end having a first thickness to a second end having a
second thickness that is larger than the first thickness. A mounting
plate is contiguous with the second end, and the mounting plate is
configured to couple the heat sink to a chassis of the electronics
enclosure. A thermal interface pad is coupled to the outer surface of the
thermal conduction section.