An embodiment of the present invention relates to a alignment measurement
system for measuring alignment between a plurality of chips of a device,
the chips being assembled in a three-dimensional stacking configuration
and equipped with at least an integrated capacitive sensor, including a
multiple-capacitor structure integrated in the capacitive sensor, at
least a sensing circuit connected to the multiple-capacitor structure
which issues an output voltage, proportional to a variation of a
capacitive value of the multiple-capacitor structure of the integrated
capacitive sensor of the device and corresponding to a measured
misalignment between the chips of the device.