The present invention relates to an integrated circuit package comprising
at least one substrate, each substrate including at least one layer, at
least one semiconductor die, at least one terminal, and an antenna
located in the integrated circuit package, but not on said at least one
semiconductor die. The conducting pattern comprises a curve having at
least five sections or segments, at least three of the sections or
segments being shorter than one-tenth of the longest free-space operating
wavelength of the antenna, each of the five sections or segments forming
a pair of angles with each adjacent segment or section, wherein the
smaller angle of each of the four pairs of angles between sections or
segments is less than 180.degree. (i.e., no pair of sections or segments
define a longer straight segment), wherein at least two of the angles are
less than 115.degree., wherein at least two of the angles are not equal,
and wherein the curve fits inside a rectangular area the longest edge of
which is shorter than one-fifth of the longest free-space operating
wavelength of the antenna.