This invention moderates the difficulty in chip formation or packaging
which accompanies thinning of a semiconductor region where an integrated
circuit is formed. An integrated circuit chip manufacturing method
includes a first bonding step of bonding a first support member to a
first surface of a semiconductor substrate which has the first surface
and a second surface and has a semiconductor region including an
integrated circuit on a first surface side thereof, a thinning step of
removing a second surface-side portion of the semiconductor substrate
bonded to the first support member to leave the semiconductor region,
thereby thinning the semiconductor substrate, a second bonding step of
bonding a second support member to the second surface side of the thinned
semiconductor substrate, and a chip forming step of forming chips by
cutting the semiconductor region.