A method of forming a three-dimensional stacked optical device includes
mounting at least one optical device to a transparent substrate,
fabricating a plurality of vias though the at least one optical device,
and filling the plurality of vias with a conductive material member that
forms a plurality of backside contacts on the at least one optical
device. The method further requires mounting an electronic chip to the
plurality of backside contacts on the at least one optical device,
fabricating a plurality of vias in the electronic chip, filling each of
the plurality of vias in the electronic chip with a another conductive
material member, and depositing a backside contact at each of the
plurality of vias formed in the electronic chip. Each backside contact is
electrically connected to corresponding ones of the another conductive
material member positioned in respective ones of the plurality of vias
formed in the electronic chip.