A semiconductor device is provided comprising: a semiconductor element
including a plurality of electrodes; first wirings coupled to the
electrodes and directed toward a center of the semiconductor element from
a portion coupled to the electrodes; second wirings coupled between the
first wirings and external terminals, the second wirings being directed
to an outer area of the semiconductor element relative to the center; and
at least one resin layer formed between the first wirings and the second
wirings.