A method of manufacturing a hermetically-sealed chamber with an electrical
feedthrough includes the step of hermetically fixing an electrode to a
substrate in a predetermined location on the substrate. A passage is
formed through the substrate through the predetermined location such that
at least a portion of the electrode is exposed to the passage. The
passage is then at least partially filled with an electrically conductive
material. A housing is then formed including the substrate such that the
housing defines a chamber, with the electrode being disposed within the
housing and the chamber being hermetically sealed. The electrode within
the chamber can be placed in electrical communication with an exterior
electrical component by way of the electrically conductive material in
the passage.