An electronic assembly includes a printed circuit board mounted with an
electronic component, a heat sink, and a clip securing the heat sink on
the printed circuit board to enable the heat sink to have an intimate
contact with the electronic component. The printed circuit board forms
two engaging portions each defining a receiving hole therein. The heat
sink includes a base and a plurality of fins. The clip includes a
pressing member pressing the heat sink to the electronic component, two
V-shaped operating members extending slantwise from ends of the pressing
member, and two clasps extending outwardly from ends of the operating
members. Height of each of the clasps is larger than that of each of the
receiving holes of the engaging portions. The clasps of the clip lock
with the engaging portions by manipulating the operating members.