A plurality of interdigitized conductive fingers are arranged to form a
substantially square configuration in each of a plurality of layers
separated by a high dielectric constant material, wherein each of the
plurality of interdigitized conductive fingers includes at least one bend
of substantially ninety degrees. The plurality of interdigitized
conductive fingers includes a first set of fingers that are connected to
an anode terminal, and a second set of fingers that are connected to a
cathode terminal. The plurality of layers includes a bottommost layer
that is in closest proximity to a substrate relative to other layers of
the plurality of layers. The bottommost layer does not include any
fingers connected to the anode terminal.