An improved memory module for mounting chips. The memory module has a circuit board which is at least partially flexible between a first part and a second part. The first part is mounted horizontally over a second circuit board, such as a mother board. The second part is then bent upward, with the memory chip(s) being mounted on the second part of the circuit board. A heat sink is mounted so that it contacts both the first, horizontal part of the circuit board, and the memory chip(s).