A spin coating apparatus requires less cleanroom air flow than prior spin coating apparatus to minimize cleanroom contamination. A shaped exhaust duct from the spin coater maintains process quality while requiring reduced cleanroom air flow. The exhaust duct can decrease in cross section as it extends from the wafer, minimizing eddy formation. The exhaust duct can conform to entrainment streamlines to minimize eddy formation and reduce interprocess contamination at minimal cleanroom air flow rates.