A test mounting for LGA packages uses curved contact fingers to make electrical contact between lands on the LGA package and surface mount circuitry on a circuit board or the like. The mounting includes a guide member with guide apertures therein spaced from a support base with corresponding guide apertures. A bending plate positioned between the guide plate and the support base is moved laterally with respect thereto to increase or decrease the distance between the ends of each contact finger and thereby connect or disconnect the ends of the contact fingers with an LGA package mounted adjacent the guide plate and circuit pads on a circuit board on which the test mounting is mounted.