A reverse mount heat dissipating device, for removing heat from an electronic device package, includes a circuit board with a bore therethrough. A semiconductor package is affixed to the top surface of the circuit board via a number of electrical contacts. The semiconductor package is positioned over the bore of the circuit board. A retaining collar is positioned in the bore of the circuit board. The retaining collar is secured in the bore in the circuit board by a circumferential groove and flanges. The retaining collar also includes a female threaded collar bore therethrough. A heat dissipating member, with a male threaded shank portion and a substantially flat top surface, is threadably received in the female threaded collar bore so that the flat top surface of the heat dissipating member is in flush thermal communication with the bottom surface of said semiconductor package. As a result, heat dissipation can be provided from a semiconductor package where mounting of a heat sink to the top of a semiconductor package is not possible.