A nest mechanism which is arranged to support a substrate during a dicing
process, and methods for using such a nest mechanism, are disclosed.
According to one aspect of the present invention, a nest apparatus
supports a substrate, which includes a chip, a first side, and a second
side, during a dicing process, includes an alignment mechanism that
positions the substrate with respect to the nest apparatus. The nest
apparatus also includes a grid arrangement that defines an opening which
receives a contact which is included on the second side of the substrate.
In one embodiment, the alignment mechanism is an alignment pin that
engages the substrate, as for example through an opening in the substrate,
to hold the substrate.