A TFT substrate is provided near its outer periphery with a metallic wiring and pad portions, and a conductive light-shielding film is provided on the outside of these. The conductive light-shielding film is left annularly along the outer peripheral portion of the TFT substrate so that, when an upper layer light-shielding film is formed on the TFT substrate, the upper layer light-shielding film on the scribed line side would not easily be exfoliated at the time of etching or cleaning. Of the conductive light-shielding film, the position of the conductive light-shielding film disposed on the outside of the pad portions is shifted to the outer side so that the spacing between the conductive light-shielding film and the pad portions is set to be, for example, not less than 10 .mu.m. By this, electrostatic trouble between the conductive light-shielding film and the pad portions is restrained.