The present invention involves a method of providing an integrated circuit package having a substrate with a vent opening. The integrated circuit package includes a substrate having an opening and an integrated circuit mounted to the substrate. An underfill material is dispensed between the substrate and the integrated circuit.

A invenção atual envolve um método de fornecer um pacote do circuito integrado que tem uma carcaça com uma abertura do respiradouro. O pacote do circuito integrado inclui uma carcaça que tem uma abertura e um circuito integrado montados à carcaça. Um material do underfill é dispensado entre a carcaça e o circuito integrado.
 
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