A surface acoustic wave (SAW) circuit package and a method of fabricating the package. In one embodiment, the package includes: (1) a substantially planar piezoelectric substrate, (2) SAW circuit conductors located over the substrate, (3) sidewalls connected to, and extending from a plane of the substrate and surrounding the SAW conductors and (4) a lid connected to the sidewalls, the substrate, sidewalls and lid cooperating to form a hermetic enclosure for the SAW conductors.