A system for cooling an electronic device containing a heat-generating component, comprises a surface thermally coupled to the heat-generating component to be heated by the component. A fabric material is positioned proximate the surface, and includes a plurality of fibers having heat conductive properties. The fabric material is configured for engaging the heated surface such that the heat conductive fibers of the fabric material are operable for conducting heat away from the surface to cool the component and the electronic device.

_ uno sistema para cooling uno electrónico dispositivo containing uno termógeno componente, abarcar uno superficie termal coupled termógeno componente ser calentar por componente. _ uno tela material ser positioned próximo superficie, y incluir uno pluralidad fibra tener calor conductor característica. _ tela material ser configured para engaging calentar superficie tal que calor conductor fibra tela material ser operable para conducting calor lejos superficie fresco componente y electrónico dispositivo. _