A liquid potting composition, a semiconductor device manufactured using such composition and a process for manufacturing a semiconductor device using such composition. The liquid potting composition comprises: (a) a liquid epoxy resin; (b) a hardener comprising a multi-hydroxy aromatic compound containing at least two hydroxy groups and at least one carboxyl group; and (c) an accelerator. Suitable hardening agents include 2,3-dihydroxybenzoic acid; 2,4-dihydroxybenzoic acid; 2,5-dihydroxybenzoic acid; 3,4-dihydroxybenzoic acid; gallic acid; 1,4-dihydroxy-2-naphthoic acid; 3,5-dihydroxy-2-naphthoic acid; phenolphthaline; diphenolic acid and mixtures thereof.