The present invention provides a non-cyanide electrolytic gold plating
solution comprising a gold compound, as a source material for gold,
selected from the group consisting of a gold salt and a gold complex, a
buffering agent, an organic brightener, and a conductive salt, wherein
1,2-ethanediamine is contained in the gold plating solution. The gold
plating solution has excellent liquid stability in a bath and causes no
change in the physical properties of the deposited gold or no
decomposition of the solution during the operation of gold plating. The
gold plating solutions include both a type in which a
bis(1,2-ethanediamine) gold complex is used as a source material for gold,
and a type in which a gold salt is used as a source material for gold. The
gold plating solution is an unprecedentedly good electrolytic gold plating
solution in which the hardness, purity, state of the deposited crystals
and so on can be controlled.