A grounding device for reducing EMI emissions generated from a processor module is herein disclosed. The processor module includes a printed circuit board (PCB), having electronic components generating unwanted electromagnetic emissions, and a thermal plate capacitively coupled to the PCB. The grounding device is coupled to a connector resident on a motherboard. The grounding device includes a number of spring contact fingers and mounting tabs. The mounting tabs are used to mount the grounding device to the motherboard in a desired position and to provide an electrical connection to the ground plane of the motherboard. The spring contact fingers enable the thermal plate to maintain physical and electrical contact with the grounding device.