A cabinet (100) for cooling electronic modules includes a first side surface (102), a second side surface (104), a front surface (106) and a rear surface (707). A plurality of chassis (108) is encompassed by the plurality of outer surfaces, wherein the plurality of chassis (108) and the first side surface (102) define a first interspace region (110), and wherein the plurality of chassis (108) and the second side surface (104) define a second interspace region (112). A plurality of electronic modules (114) is coupled to each of the plurality of chassis (108), where the plurality of electronic modules (114) are substantially horizontally disposed within each of the plurality of chassis (108), and wherein at least a portion of the plurality of electronic modules produce more than 150 Watts of thermal energy each. An air moving apparatus (118) draws cooling air (116) external to the cabinet (117) into the first interspace region (110), wherein the cooling air (116) passes over the plurality of electronic modules (114) in a substantially horizontal manner and substantially parallel to the front surface (106) and the rear surface (707), wherein the cooling air (116) subsequently enters the second interspace region (112) and is thereafter exhausted from the cabinet (100).