A film-type adhesive for electronic components comprises a polyimide resin
made up of specific repeating units and having a weight-average molecular
weight of 5,000-150,000 in combination with an epoxy resin bearing at
least two glycidyl groups per molecule. The adhesive has a weight ratio of
the polyimide resin to the epoxy resin within a range of 50/50 to 5/95,
and a film thickness of 20-150 .mu.m. Such a film-type adhesive makes it
possible to simplify and shorten the duration of assembly operations for
electronic components having various types of adherend surfaces.