A decorative jewelry stone and process for developing the stone. The process includes providing a primary stone and defining a cutting plane on the primary stone. The primary stone is then cleaved at the cutting plane to produce first and second portions, each of the first and second portions having a planar surface. A cavity is then bored into the planar surface of one of the first and second portions of the primary stone. A secondary stone is then placed within the cavity and a bonding agent is applied to the planar surface of one of the first and second portions. The planar surfaces of the first and second portions are then placed against one another allowing the bonding agent to cure and thereby permanently fix the first and second portions together sealing the secondary stone therebetween. The cavity may be dimensioned to be substantially equal to a size of the secondary stone so that the secondary stone fits tightly within the cavity or substantially larger in size than the secondary stone so that the secondary stone fits loosely within said cavity thereby allowing the secondary stone to move freely. The bonding agent includes a transparent UV curing agent and a transparent heat-curing agent.