A method and a device for thermally connecting the terminal areas (26, 27)
of a contact substrate (11) to the terminal areas (28, 29) of a carrier
substrate (12), where the substrates (11, 12) are, in order to produce the
connection, arranged in a connecting position such that the terminal areas
(26, 28; 27, 29) are situated opposite one another in the plane of the
connection, where the contact substrate (11) is heated to the connecting
temperature from its rear side that is situated opposite the terminal
areas (26, 27) in order to reach the required connecting temperature in
the plane of the connection, and where the contact substrate (11) is
heated by subjecting the substrate to laser energy.
Een methode en een apparaat om de eindgebieden thermaal te verbinden (26, 27) van een contactsubstraat (11) aan de eindgebieden (28, 29) van een dragersubstraat (12), waar de substraten (11, 12), om de verbinding te veroorzaken, worden geschikt in een verbindende positie dusdanig dat de eindgebieden (26..28;,27, 29) zijn elkaar gesitueerd tegenover in het vliegtuig van de verbinding, waar contactsubstraat (11) aan de verbindende temperatuur van zijn achterkant wordt verwarmd die tegenover de eindgebieden gesitueerd is (26, 27) om de vereiste verbindende temperatuur in het vliegtuig van de verbinding te bereiken, en waar (11) to the terminal areas (28, 29) of a carrier substrate (12), where the substrates (11, 12) are, in order to produce the connection, arranged in a connecting position such that the terminal areas (26,,28;,27, 29) are situated opposite one another in the plane of the connection, where the contact substrate (11) is heated to the connecting temperature from its rear side that is situated opposite the terminal areas (26, 27) in order to reach the required connecting temperature in the plane of the connection, and where the contact substrate (11) is heated by subjecting the substrate to laser energie.
