A curable slurry for forming ceramic microstructures on a substrate using a
mold. The slurry is a mixture of a ceramic powder, a fugitive binder, and
a diluent. The ceramic powder has a low softening temperature in a range
of about 400.degree. C. to 600.degree. C. and a coefficient of thermal
expansion closely matched to that of the substrate. The fugitive binder is
capable of radiation curing, electron beam curing, or thermal curing. The
diluent promotes release properties with the mold after curing the binder
or quick and complete burn out of the binder during debinding.
