An apparatus for holding an object to be processed, according to this
invention is mounted in a plasma processing apparatus and includes a
convex-shaped holder main body, first dielectric film, and second
dielectric film. The holder main body has a holding portion which holds an
object to be processed placed on it and a flange formed on the peripheral
portion of the holding portion to fit with a focus ring. The first
dielectric film attracts the object to be processed placed on the holding
portion to the holder main body by a Coulomb force. The second dielectric
film attracts the focus ring fitted on the flange to the holder main body
by an attracting force larger than that of the first dielectric film using
a Johnson-Rahbek force. The electrostatic attracting force of the focus
ring for the holder main body is increased, so that the cooling effect is
increased. A change in plasma processing characteristics over time in the
vicinity of the focus ring can be eliminated, and the entire surface of
the object to be processed can be processed uniformly.