A metal plating bath and method of plating a metal on a substrate where the
metal plating bath contains heteroatom organic compounds that prevent or
inhibit the consumption of metal plating bath additives. The metal plating
bath additives improve the brightness of plated metal as well as the
ductility, micro-throwing power and macro-throwing power of the plating
bath. The addition of the additive consumption inhibiting heteroatom
organic compounds improves the physical properties of the plated metal as
well as the efficiency of the plating process. The heteroatom organic
compounds may contain sulfur, oxygen or nitrogen heteroatoms.
