A two sided wafer handling end-effector provides for the efficient loading
and unloading of wafers into and out of a wafer processing apparatus. Each
side of the end-effector includes spaced apart rotatable catch mechanisms
between which a wafer is firmly grasped. When the end-effector is
positioned beneath the wafer processing apparatus, the catch mechanisms
are rotated to an open position and a lifting surface on the catch
mechanisms lifts the wafer into the wafer processing apparatus. When the
catch mechanisms are in the open position, the wafer is centered on the
end-effector by rotatable rocker assemblies that contact the edge of the
wafer. As the end-effector is raised into contact with the processing
apparatus, the rocker assemblies rotate to a lowered position in the
end-effector while arcuate surfaces on the assemblies maintain contact
with the wafer edge.
