An electronic assembly that includes a heat sink, a thermal interface
material, integrated circuit, and a package connected to the integrated
circuit. The thermal interface material is positioned between a first
surface on the package and a second surface on the heat sink to improve
thermal conductivity between the package and heat sink. At least one of
the first and second surfaces includes either a cavity that traps excess
thermal interface material when the heat sink is compressed against the
package, or a protrusion that maintains bond line thickness between the
heat sink and package.
