This invention is to propose a technique of producing a printed wiring
board having an excellent adhesion property between an electroless plated
film and an electrolytic plated film constituting a conductor circuit
through a semi-additive process without causing the peeling of a plating
resist and is a printed wiring board comprising conductor circuits formed
on a roughened surface of an insulating layer, in which the conductor
circuit is constituted with an electroless plated film at the side of the
insulating layer and an electrolytic plated film at the opposite side and
the electroless plated film located at the side of the insulating layer is
formed so as to follow to the roughened surface of the insulating layer.
This printed wiring board is produced by a semi-additive method wherein
the electroless plated film is formed on the roughened surface of the
insulating layer so as to follow to the roughened surface of the
insulating layer.
