Disclosed formulations of supercritical solutions are useful in wafer
cleaning processes. Supercritical solutions of the invention may be
categorized by their chemistry, for example, basic, acidic, oxidative, and
fluoride chemistries are used. Such solutions may include supercritical
carbon dioxide and at least one reagent dissolved therein to facilitate
removal of waste material from wafers, particularly for removing
photoresist and post-etch residues from low-k materials. This reagent may
include an ammonium carbonate or bicarbonate, and combinations of such
reagents. The solution may include one or more co-solvents, chelating
agents, surfactants, and anti-corrosion agents as well.
