A metal frame for electronic hardware and a method of manufacturing such a
frame wherein at least a portion of the frame is made of bulk-solidifying
amorphous alloys or bulk-solidifying amorphous alloy-composites is
provided. The metal frames of the invention are preferably made of
bulk-forming amorphous alloys or bulk-forming amorphous alloy-composites
having an elastic limit for the metal frame of at least about 1.5%, and
preferably greater than about 2.0%, a .DELTA.Tsc of more than 30.degree.
C., and at least one of the following properties: a hardness value of
about 4 GPA or more, and preferably 5.5 GPA or more; a yield strength of
about 2 GPa or more; a fracture toughness of about 10 ksi-sqrt(in)
(sqrt:squre root) or more, and preferably 20 ksi sqrt(in) or more; and a
density of at least 4.5 g/cc or more.
