By using a conductive adhesive prepared by dispersing conductive particles
such as a nickel filler in a thermally or optically curable adhesive
comprising a base resin having heat resistance and flexibility after
curing, such as EVA, PVB, acrylic resin or unsaturated polyester, as an
adhesive for making the shielding conductive layer of a shielded flat
cable conductive with the ground line of a cable body in a non-insulated
portion and bonding the cable body to the shielding member, the heat
resistance and connection reliability in a high temperature and high
humidity condition of the shielded flat cable are ensured.
To further improve adhesion, a phosphoric acid methacrylate and
melamine-based resin are blended with the above base resin.
