An expitaxial layer structure that achieves reliable, high speed, and low
noise device performance in indium phosphide (InP) based heterojunction
bipolar transistors (HBTs) for high data rate receivers and optoelectronic
integrated circuits (OEIC). The layer consists of an n+ InGaAs
subcollector, an n+ InP subcollector, an unintentionally doped InGaAs
collector, a carbon-doped base, an n-type InP emitter, an n-type InGaAs
etch-stop layer, an n-type InP emitter, and anInGaAS cap layer.