A curable film-forming composition is provided comprising in a medium (i)
10 to 90 percent by weight based on the total weight of solids in the
film-forming composition of a crosslinking agent; (ii) 10 to 90 percent by
weight based on the total weight of solids in the film-forming composition
of a polymer containing a plurality of functional groups reactive with the
crosslinking agent; and (iii) at least 20 percent by volume based on the
total volume of the film-forming composition of particles having a mean
particle size less than 100 nm. A cured composition comprising the
crosslinking agent of (i) and the polymer of (ii) has a cured softening
point of less than 30.degree. C. The particles of component (iii) further
have a hardness value greater than 5 on the Moh hardness scale, and have
an affinity for the medium sufficient to keep the particles suspended
therein. The affinity of the particles for the medium is greater than the
affinity of the particles for each other, thereby preventing agglomeration
of the particles within the medium.
Cured compositions having a film thickness of at least 5 microns
demonstrate excellent chip resistance, superior sandability and resistance
to scratching, water spotting and acid etch.
