A modularized probe card comprising an interface board, a probe head and at
least a compressible electrical connection device is disclosed. The
compressible electrical connection device comprises an insulation layer
with a plurality of circuits on one of its surface. Two ends of each
circuit connect respectively to the first contacting pad and the second
contacting pad which combine with elastic contact members. Each elastic
contact member has a supporter combining with a conductive layer for
electrical connections by pushing and compressing. While a probe head is
modularized installed on an interface board, the elastic contact members
of the compressible electrical connection device is elastically contacted
and compressed the probe head and the interface board to acquire
modularized electrical connection of the probe card.
